Study the effect of ammonia addition on the mechanism and properties of electrochemical deposition of silver and nickel alloy
Ag-Ni alloy films were electrodeposited from an ammonia solution on copper substrates at various material ratios and current densities. Investigation of electrical conductivity and pH, formation of complexes with silver and nickel. X-ray diffraction.
| Рубрика | Химия |
| Предмет | Chemistry |
| Вид | статья |
| Язык | английский |
| Прислал(а) | Al Khuri |
| Дата добавления | 16.01.2021 |
| Размер файла | 711,9 K |
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